OG视讯

As the first AEC member among OSAT providers from China’s mainland, JCET brings extensive expertise and high-volume manufacturing experience in automotive electronics. Its broad portfolio spans conventional and advanced packaging, supporting diverse requirements from mature-node devices to heterogeneous integration.

For automotive MCUs, JCET offers competitive QFP, QFN and BGA solutions, including copper wire bonding, as well as advanced options such as automotive-grade FC-BGA, SiP and eWLB. For new energy power applications, JCET develops and manufactures silicon based SiC-based and GaN-based devices and modules, supported by DBC, DBA and AMB substrates, multiple interconnect technologies, silver and copper sintering, and embedded module solutions.